发明名称 PROCESS FOR PRODUCING SUBSTRATE USING SUBSTRATE CONNECTION TAPE
摘要 PROBLEM TO BE SOLVED: To provide a process for producing a flexible substrate exhibiting excellent carrying performance of a flexible substrate material while suppressing damage on the substrate material. SOLUTION: In the process for producing a substrate where substrate materials 4 are carried while coupling the edges thereof in the carrying direction by means of a substrate connection tape 1 produced by laminating at least a layer dissolving into etching liquid, a layer dissolving into resist removing liquid and exhibiting etching resistance, and a layer dissolving into resist removing liquid and exhibiting sensitivity to UV-rays, tape paste side at a tape paste portion and/or the rear surface is irradiated with UV-rays after the substrate connection tape 1 is pasted. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006269559(A) 申请公布日期 2006.10.05
申请号 JP20050082716 申请日期 2005.03.22
申请人 MITSUBISHI PAPER MILLS LTD;NIPPON TEKKU KK 发明人 NAKAGAWA KUNIHIRO;IRISAWA MUNETOSHI;IIDA MASUO
分类号 H05K3/06 主分类号 H05K3/06
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