Semiconductor sensor component comprises a cavity container and components arranged in a cavity of container, which exhibit a sensor chip with a sensor range, where cavity container exhibits opening and sensor range is turned to opening

摘要

Semiconductor sensor component comprises a cavity container (2) and components arranged in a cavity (3) of the container, which exhibit a sensor chip (4) with sensor range (5), where the cavity container exhibits an opening (6), the sensor range is turned to the opening, the sensor chip is embedded in the cavity of the container into back or edges of a rubber elastic layer (7) that exhibits cleavable store-metal-organic or inorganic metal containing-complex (11), which lies freely at the top side of the elastic layer and forms metallic-germs for wiring lines (14). Semiconductor sensor component comprises a cavity container (2) and components arranged in a cavity (3) of the container, which exhibit a sensor chip (4) with sensor range (5), where the cavity container exhibits an opening (6) for adjacency and the sensor range is turned to the opening, the sensor chip is embedded in the cavity of the container into back or edges of a rubber elastic layer (7) that exhibits cleavable store-metal-organic or inorganic metal containing-complex (11), which lies freely at the top side of the elastic layer and forms metallic-germs for wiring lines (14), the wiring lines electrically connects to the sensor range of the sensor chip with contact connection areas in the cavity of the cavity container, the top of the components within the cavity container is arranged to an elastic sealing layer (17). An independent claim is included for the preparation of semiconductor sensor components.