| 摘要 |
PROBLEM TO BE SOLVED: To improve a memory module and its design technology. SOLUTION: An embodiment of the memory module and a corresponding method are disclosed. One memory module embodiment (100) of the memory module comprises an upper row of a memory integrated circuit (102) and a lower row of the memory integrated circuit (102), and a printed circuit board provided with a first addressing register (110a) and a second addressing register (110b). The first addressing register and the second addressing register have at least one of a address and a control input route primarily provided in a first layer (700), the first addressing register is coupled to the upper row of the memory integrated circuit, and the second addressing resister is coupled to the lower row of the memory integrated circuit. COPYRIGHT: (C)2007,JPO&INPIT
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