发明名称 COMPOUND SENSOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a compound sensor for achieving miniaturization of a mounting substrate by compounding an angular speed sensor and an acceleration sensor to reduce a mounting area without needing the mounting area of the angular speed sensor and the mounting area of the acceleration sensor. <P>SOLUTION: The compound sensor having the angular speed sensor and the acceleration sensor is provided with two cone parts 8 connected to a fixing base part 4, a first vibrating element 10 for connecting one end to one cone part 8 and connecting the other end to the other cone part 8, and a second vibrating element 12 for connecting one end to the cone part 8. The first vibrating element 10 and the second vibrating element 12 are driven and vibrated, and drive vibration of the first vibrating element 10 changed by being caused by movement of the cone part 8 is detected to detect an acceleration. Curvature vibration of the second vibrating element 12 changed by being caused by Coriolis force is detected to detect an angular speed. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006226802(A) 申请公布日期 2006.08.31
申请号 JP20050040145 申请日期 2005.02.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TERADA JIRO;ISHIDA TAKAMI;KAWASAKI TETSUO
分类号 G01C19/56;G01P9/04;G01P15/10;H01L41/08;H01L41/18;H01L41/187 主分类号 G01C19/56
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