| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize downsizing of a compound semiconductor device having a light-emitting device and a protection element. <P>SOLUTION: The compound semiconductor device is provided with a light-emitting device (1) and a protective element (2). The light-emitting device (1) is comprised of a p-type semiconductor substrate (3), a light-emitting semiconductor region (7) and first and second electrodes (8) and (9). The protective element (2) comprises an n-type semiconductor thin film (11) which is arranged in the outer periphery of the p-type semiconductor substrate (3), and on the side surface (17) of the light-emitting semiconductor region (7), with an insulating film (10) interposed. The n-type semiconductor thin film (11) is in contact with the p-type semiconductor substrate (3) in p-n manner, thus forming a protective diode. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
