发明名称 Semiconductor device and its manufacturing method
摘要 A semiconductor device which has a source/drain extension structure suitable for miniaturization, is provided a semiconductor device comprising a gate electrode formed on a semiconductor substrate of a first conductivity type via a gate insulator, a semiconductor region of a second conductivity type comprising first and second semiconductor areas, wherein the first semiconductor area is formed in the semiconductor substrate outside the gate electrode and whose junction depth becomes deeper as apart from the gate electrode, and wherein the second semiconductor area is disposed outside the first semiconductor area and whose junction depth is substantially constant, and an insulator formed to cover a part of the first semiconductor area and in contact with a side face of the gate electrode.
申请公布号 US2006194398(A1) 申请公布日期 2006.08.31
申请号 US20050264377 申请日期 2005.11.02
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 OISHI AMANE;KOMODA TAIKI
分类号 H01L21/336;H01L21/8234 主分类号 H01L21/336
代理机构 代理人
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