SEMICONDUCTOR PACKAGE, A PANEL AND METHODS OF ASSEMBLING THE SAME

摘要

An encapsulated leadless semiconductor package (8; 30) comprises a first semiconductor die (1) and a second semiconductor die (2) which are electrically connected by a bond wire (19). The lower surface (7) of the first semiconductor die (1) and the lower surface (7) of the second semiconductor die (2) are essentially coplanar with the lower surface (25) of the encapsulation material (23).