发明名称 FLEXIBLE PRINTED-WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF MULTILAYER FLEXIBLE PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed-wiring board that has the large contact area between an interlayer connection section and a conductive layer and excellent reliability in the electric connection between the conductor layers, can prevent the separation, or the like of a junction interface caused by heating since stress in a thickness direction by thermal expansion can be relieved by conically forming the interlayer connection section, and is reliable in electric connection; and to provide a method for manufacturing the flexible printed-wiring board, and a method for manufacturing a multilayer flexible printed-wiring board. SOLUTION: The flexible printed-wiring board 1 has a conical conductor press-in hole 6, and a conductor 7. The conductor press-in hole 6 is punched in one upper surface conductive layer 3, where the interlayer connector 5 is laminated to at least the insulating layer 2, and the insulating layer 2, and is enlarged and opened to the side of one upper conductive layer 3. The conductor 7 is pressed in the conductor press-in hole 6, and electrically connects the upper surface of one upper surface conductor layer 3 and a side at the side of the conductor press-in hole 6 of one upper surface conductor layer 3 to a side at the side of the conductor press-in hole 6 of the other lower surface conductor layer 4 laminated to the insulating layer 2 or a surface at the side of the insulating layer 2 of the other lower surface conductive layer 4. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006156553(A) 申请公布日期 2006.06.15
申请号 JP20040342221 申请日期 2004.11.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OKAMOTO KATSUYA;NAKAJIMA KOJI;YOSHINO TOYOICHI;MORIMOTO SHINJI
分类号 H05K1/11;H05K3/46 主分类号 H05K1/11
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