| 摘要 |
PROBLEM TO BE SOLVED: To provide a connecting structure between substrates in mobile equipment for achieving high-density packaging, and to provide an electronic circuit device using the connecting structure. SOLUTION: In the connecting structure between substrates in the mobile equipment, circuit boards 4, 5 in which an electric terminal 6 is provided at each of at least two parallel sides; a laminated substrate support mechanism 2 for supporting the plurality of circuit boards 4, 5 for holding each of at least two sides for separating up and down; and a three-dimensional wiring 3 for connecting the electric terminals 6 of the plurality of isolated circuit boards 4, 5 provided at a multiple-stage recess, in a laminated substrate support mechanism 2 for supporting each of at least two sides are provided, thus achieving the connecting structure between substrates that is strong in positioning precision and impact resistance and has high repairing properties and versatility. COPYRIGHT: (C)2006,JPO&NCIPI |
