发明名称 Multi-socket circuit board chip bridging device
摘要 A multi-socket circuit board chip bridging device is proposed, which is designed for use in conjunction with a multi-socket circuit board having multiple sockets and utilizing a special type of bus architecture, such as the HT (HyperTransport) bus architecture, for use to be mounted on a selected one of the sockets for the purpose of connecting one chip mounted on a first socket to another chip mounted on a second socket on the multi-socket circuit board. This feature allows manufacturer to utilize just one kind of circuit board for the implementation of a variety of multi-processor computer motherboards or hardware platforms having different number of processors, without having to design different types of multi-processor computer motherboards, thus representing a more cost-effective solution to the manufacture of multi-processor computer motherboards than prior art.
申请公布号 US2006129732(A1) 申请公布日期 2006.06.15
申请号 US20040011132 申请日期 2004.12.15
申请人 TSAI SHENG-YUAN;YANG CHI-WEI 发明人 TSAI SHENG-YUAN;YANG CHI-WEI
分类号 G06F13/14 主分类号 G06F13/14
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