发明名称 THERMOSETTING RESIN COMPOSITION, THERMOSETTING FILM, CURED PRODUCT THEREOF, AND ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a cured product with extremely small change of physical property in a reliability test, excellent in mechanical property, electrical property, insulating property, heat resistance, thermal shock resistance and reliability, and to provide a thermosetting resin composition imparting the cured product. SOLUTION: The thermosetting resin composition comprises (A) an epoxy resin, (B) a crosslinked diene-based rubber containing <10 wt.% of bonded acrylonitrile, (C) an antioxidant, (D) a curing agent and (E) a curing catalyst. Wherein the diene-based crosslinked rubber (B) is preferably a copolymer of a crosslinking monomer having at least two polymerizable unsaturated bonds and excluding acrylonitrile. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006152148(A) 申请公布日期 2006.06.15
申请号 JP20040346198 申请日期 2004.11.30
申请人 JSR CORP 发明人 GOTO HIROFUMI;IWANAGA SHINICHIRO
分类号 C08L63/00;C08L9/00 主分类号 C08L63/00
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