| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inspection method, when simultaneously inspecting the sensitivity of two orthogonal detection axes of a multi-axial semiconductor acceleration sensor on the basis of vibration, which performs proper sensitivity inspection for each detection axis, by absorbing a degree deviation between a vibrating axis and the tilt angle of the acceleration sensor, even when allowable values (the degree of margin) for sensitivity errors are different between the two detection axes. <P>SOLUTION: Difference in sensitivity specifications, which is the difference in the allowable value for each sensitivity error of the two orthogonal detection axes (X-axis, Y-axis), and an angle error at the vibration of the acceleration sensor 30 with respect to the vibrating axis, including an installation error of the acceleration sensor 30 with respect to a socket 40 are determined. On the basis of these factors, the tilt angle of the acceleration sensor 30, with respect to the vibrating axis is set so that the sensitivity specification differences become the same. After the tilt angle is thus set, the acceleration sensor 30, together with the socket 40 and a socket-fixing tool 41, is vibrated in the direction of the vibrating axis by a vibration exciter 60 and the sensitivity of the acceleration sensor 30 is inspected. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
