| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad which is formed with a region that transmits end point detecting light without deteriorating the polishing performance of the polishing pad in chemical mechanical polishing using an optical end point detection device. <P>SOLUTION: The chemical mechanical polishing pad includes a water-insoluble matrix and water-soluble particles dispersed into the water-insoluble matrix, and is formed with a polishing surface and a non-polishing surface opposite to the polishing surface. The polishing pad is formed with a translucent region where light can be transmitted from the polishing surface to the non-polishing surface, and the non-polishing surface in the translucent region has a surface roughness (Ra) of 10 μm or smaller. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
