SEMICONDUCTOR PACKAGE AND OPTICAL COMMUNICATION MODULE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an optical communication module that can reduce heat generation as much as possible and generates less malfunction due to noise, or a semiconductor device. SOLUTION: The semiconductor package is provided with a sealed container 162, a substrate 156 that is housed in the sealed container, a plurality of integrated circuits 154 and 160 that are placed on the substrate and are connected with each other by means of signal wiring, and a shielding plate 158 that is inserted into the substrate as to be engaged with a total thickness of the substrate excluding the signal wiring between the adjoining integrated circuits among the integrated circuits in the sealed container. COPYRIGHT: (C)2005,JPO&NCIPI