| 摘要 |
PROBLEM TO BE SOLVED: To provide ah adhesive tape for working semiconductor substrate in which adhesion of adhesive waste to a surface of PKG is less, and adhesion (paste remainder) to a rear face of PKG is less at the time of pickup after radiation irradiation when a semiconductor substrate is worked. SOLUTION: In the adhesive tape for working semiconductor substrate, adhesive formed of base resin, a radiation polymerized compound, radiation polymerization initiator and cross linking agent is applied on a film substrate face having permeability against ultraviolet rays and/or electron beams. In adhesive, adhesive thickness is 8 to 30μm and it consists of 100 wt.% of base resin, 20 to 100 wt.% of radiation polymerized compound, 1 to 10 wt.% of radiation polymerization initiator and 1 to 10 wt.% of cross linking agent. The radiation polymerized compound consists of acrylate monomer of five or more organic functions having 500 to 1,000 molecular weight. COPYRIGHT: (C)2005,JPO&NCIPI |
