| 摘要 |
PURPOSE:To select one operating mode of a plurality of operating modes by a method wherein with bonding pads each formed into a special form, the bonding of the bonding wire to the bonding pads is selected. CONSTITUTION:The bonding pads 3A and 3B of three bonding pads 3A, 3B and 3C, which are used as ones for power source, are each split into electrodes 31 and 32, and at the same time, the electrodes 31 and 32 are each formed into a comb-teeth form and the pad 3C is formed in a square. The electrodes 31 and 31 on one sides of these pads 3A and 3B and the pad 3C are connected to the power lines on the hot sides of circuits 2A-2C through conductive patterns 4A-4C and the electrodes 32 and 32 on the other sides of the pads 3A and 3B and the pad 3C are mutually connected through a conductive pattern 6. The pellet side end parts 7A-7N of the external terminal pins are faced the vicinity of a pellet 1. Assuming that the circuit 2A is a circuit peculiar to an NTSC system, the circuit 2B a circuit peculiar to a PLA system and the circuit 2C a common circuit to the NTSC system and the PLA system, this IC becomes one for the NTSC system when a bonding wire 8 is bonded on the pad 3A at the time of bonding and when the wire 8 is bonded on the pad 3B, this IC becomes one for the PAL system.
|
