| 摘要 |
PURPOSE:To enable to effectively connect fine metal wirings by an automatic bonder by forming the thickness of a bonding part of the end of a lead thinner than that of a lead frame and forming of leads of two types at least different thickness of the bonding part. CONSTITUTION:This lead frame is formed of a tab 1 for fixing an IC element and inner leads 2a, 2b of different coining depth at the ends disposed at the periphery. The inner lead 2a is formed of a deep inner lead of coining depth, the inner lead 2b is formed of shallow inner lead of coining depth so that the lead 2a is deeper in coining depth. Accordingly, the amount crushed by the coining becomes more. Since the optimum coining depth can be selected to match to the width at the end of the inner lead, the maximum area of the range that the ends of the inner leads do not contact is obtained, and the wire bonding of the automatic bonder can be remarkably established. |
