发明名称 High temperature post exposure baking treatment for positive photoresist compositions
摘要 The invention provides a method for producing a photographic element which comprises coating a substrate with a positive working photosensitive composition which composition comprises an aqueous alkali soluble resin, a quinone diazide photosensitizer and a solvent composition, heat treating said coated substrate at a temperature of from about 20 DEG C. to about 100 DEG C. until substantially all of said solvent composition is removed; imagewise exposing said photosensitive composition to actinic radiation; baking said coated substrate at a temperature of from about 120 DEG C. to about 160 DEG C. for from about 15 seconds to about 90 seconds; and removing the exposed non-image areas of said composition with a suitable developer.
申请公布号 US4885232(A) 申请公布日期 1989.12.05
申请号 US19860921879 申请日期 1986.10.17
申请人 HOECHST CELANESE CORPORATION 发明人 SPAK, MARK A.
分类号 G03F7/16 主分类号 G03F7/16
代理机构 代理人
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