Electronic control unit and rotating electric machine

摘要

An electronic control unit is equipped with a semiconductor module having a semiconductor chip electrically connected to the first circuit pattern and the second circuit pattern. A resin body is wrapped around the semiconductor chip. A first metal plate has a side connected to the semiconductor chip and an other side connected to the first circuit pattern. A radiator projects toward and is connected to the first circuit pattern by a first heat conductor. As a result, heat generated by the semiconductor chip is transmitted to the radiator through the first metal plate, the first circuit pattern, and the first heat conductor during operation of the semiconductor module.

主权项

1. An electronic control unit comprising:
a substrate; a first circuit pattern and a second circuit pattern disposed on the substrate; a semiconductor chip electrically connected to the first circuit pattern and the second circuit pattern; a resin body wrapped around a portion of the semiconductor chip and having a board shape with a first face facing the substrate and a second face facing away from the substrate; a first metal plate having a side connected to the semiconductor chip and having an other side connected to the first circuit pattern; a radiator having a base portion and a first shaped portion, the base portion having a board shape with a predetermined thickness, the base portion disposed on an opposite side of the resin body relative to the substrate, the first shaped portion projecting from the base portion toward the first circuit pattern and forming a first gap that is defined between the first shaped portion and the first circuit pattern; a first heat conductor disposed in the first gap and transmitting heat from the first circuit pattern to the radiator; a second metal plate disposed on an opposite side of the semiconductor chip relative to the first metal plate to sandwich the semiconductor chip between the first metal plate and the second metal plate, the second metal plate having a side connected to the semiconductor chip and an other side facing away from the second face of the resin body; a second shaped portion of the radiator projecting from the base portion toward the second metal plate to form a second gap that is defined between the second shaped portion and the second metal plate; and a second heat conductor disposed in the second gap to transmit heat of the second metal plate to the radiator, wherein the radiator further comprises a boss and a support projecting from the base portion of the radiator as one body, the boss and the support abutting at least one of the substrate, the first circuit pattern and the second circuit pattern, and the second shaped portion has a surface that faces the resin body, the surface has an area that is equal to or greater than an area of the second face of the resin body, and the second shaped portion is unitary with and projects directly from the base portion toward the second metal plate.