| 摘要 |
<p>PURPOSE:To improve adhesion by winding the inside electrode of an outer semi-conductive layer through a resin tape composed of same or identical material to the base resin composing the inside electrode then thermally fusing the entirety of joint and molding. CONSTITUTION:Outer semi-conductive layers 7, 8 splitted into two are formed on the outer circumference of an insulator 6. The inside electrode 7a of one outer semi-conducting layer 7 is placed at the inside then the outer electrode 8a of the other semi-conductive layer 8 is lapped thereon through a predetermined insulation gap. At this time, a resin tape 10 composed of same material as the base resin composing the inside electrode 7a is wound around the inside electrode 7a. Then a stop tape is applied on the outer semi-conductive layers 7, 8 thereafter a yet-crosslinked or insufficiently cross-linked insulator 6 and the outer semi-conductive layer 7, 8 are fusion molded and cross-linked to the final stage. By such arrangement, a high breakdown-proof voltage can be achieved.</p> |
