发明名称 |
ARRANGEMENT FOR MONITORING THE TEMPERATURE IN FLOW SOLDERING OF FLAT MODULES |
摘要 |
A pyrometer is located beneath a soldering path downstream of a flow nozzle and is shielded by a metal plate which extends transversely relative to the soldering direction and obliquely upwardly toward the path. The pyrometer is connected to a limit value generator which responds when the limit value is exceeded.
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申请公布号 |
CA2000895(A1) |
申请公布日期 |
1990.04.19 |
申请号 |
CA19892000895 |
申请日期 |
1989.10.17 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
DEGLE, WALTER;MUELLER, HELMUT |
分类号 |
B23K1/08;H05K1/02;H05K3/34;(IPC1-7):G01J5/02 |
主分类号 |
B23K1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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