发明名称 ARRANGEMENT FOR MONITORING THE TEMPERATURE IN FLOW SOLDERING OF FLAT MODULES
摘要 A pyrometer is located beneath a soldering path downstream of a flow nozzle and is shielded by a metal plate which extends transversely relative to the soldering direction and obliquely upwardly toward the path. The pyrometer is connected to a limit value generator which responds when the limit value is exceeded.
申请公布号 CA2000895(A1) 申请公布日期 1990.04.19
申请号 CA19892000895 申请日期 1989.10.17
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 DEGLE, WALTER;MUELLER, HELMUT
分类号 B23K1/08;H05K1/02;H05K3/34;(IPC1-7):G01J5/02 主分类号 B23K1/08
代理机构 代理人
主权项
地址