| 摘要 |
PURPOSE:To suppress excessive melting of coating for preventing occurrence of electrical short-circuit by shortening time of discharge generated at the time of forming a ball at the tip of an insulated wire. CONSTITUTION:When a capillary 8 is lowered, a ball 27 is pressed against a connection pat 30 placed on a semiconductor device 26 which has been heated to specified temperature, specific load 31 and horizontal supersonic vibration 32 are applied by the capillary 8 to connect the ball 27 to the connection pad 30. Then after the capillary 8 is lifted and stopped, CO2 laser 18 or the like led by a fiber from a coating removing apparatus is radiated to a insulated wire 13 to remove coating. As regards the height for radiating the CO2 laser 18 to the covered wire 13, length of the covered wire 13 needed for a corresponding wire has been input as data to a controller, and a Z stage is driven and set according to the data. After completion of removal of the coating, the semiconductor device 26 is positioned at a second bonding position, and the capillary 8 is lowered to press a core 28 against a lead 33 to apply supersonic vibration to make connection. |
