| 摘要 |
PURPOSE:To improve mold releasing ability by reducing a coefficient of friction when removing the electrodeposit such as copper of Ni with required thickness for coating by plating non-electrolytic Ni to Al alloy in a required shape and blowing conductive coating to core metal including tetrafluoride ethylene in fine holes. CONSTITUTION:The permanent core metal is used while defattering and acid- cleaning the Al alloy, subjecting the non-electrolytic Ni plating and including the tetrafluoride ethylene into fine holes. The conductive coating 3 is applied onto a non-electrolytic Ni plating layer 2, which includes Teflon in the Al alloy and Cu or Ni electric plating 4 is applied. Then, the mold of the plating layer 4 is released. Therefore, a waveguide 5 is obtained. Since the tetrafluoride ethylene is included in the file holes, the wearing resistance of the core metal is improved. On the other hand, the film thickness of the non-electrolytic Ni plating is made uniform and the reproducibility of an original shape is made satisfactory. By including the tetrafluoride ethylene, not only the wearing resistance of Ni is improved but also the coefficient of friction is reduced and the mold can be easily released. Further, the manufacture cost of this waveguide is reduced. |
