首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
WAFER PACKAGING METHOD
摘要
申请公布号
JPH04128173(A)
申请公布日期
1992.04.28
申请号
JP19900249787
申请日期
1990.09.19
申请人
TSUNABUCHI TERUYUKI
发明人
TSUNABUCHI TERUYUKI
分类号
B65D85/86;B65D85/38
主分类号
B65D85/86
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Color correction system employing reference pictures
Membrane packing
N-(aryloxyalkyl)heteroarylpiperidines and heteroarylpiperazines a process for their preparation and their use as medicaments
Werkwijze ter vervaardiging van een kathode-onderdeel en elektronenbuis die daarmee is uitgerust.
High-density absorbent structure
Ensiling composition
Mechanical fastening system with grip tab
Pant diaper or sanitary panty having a detachably connected front part
Consolidating soil during tunnel boring by injecting stabilising material into holes drilled in sides of tunnel
METHOD OF DECREASING CARBON DIOXIDE PRODUCTION
METHOD OF PRODUCING VIRUS-SAFE HIGHLY PURIFIED FACTOR VIII, AND PROCESS FOR ITS PRODUCTION
FIBROUS POLYSACCHARIDES OF CATIONIC NATURE, PROCESS OF THEIR PREPARATION AND THEIR USE
DISMANTLEABLE NUCLEAR FUEL ASSEMBLY WITH CASING
APPLICATION OF RILUZOLE IN THE TREATMENT OF PARKINSON'S DISEASE AND PARKINSONIAN SYNDROMES
CIRCUIT OF BUFFER AMPLIFIER WITH SURFACE ACOUSTIC WAVE ELEMENT
Business management system
Blister package
Improved power management circuit
Improving the sealing of bonded batts
Blowing agent powder and process for producing
