| 摘要 |
PURPOSE:To enable a thin electronic component mounting device to be easily and surely manufactured by a method wherein an electronic component is mounted on an electrically independent lead, and nearly all the component and the lead are sealed up with sealing material. CONSTITUTION:A plating layer 14 is formed on both the sides of a part of a metal material which is used for forming an electrically independent lead 10 and a mounting pad 11, where the part concerned is made to serve as the lead 10. The disused part other than the lead 10 and the mounting pad 11 is removed by etching for the formation of a holding part. An electronic component 20 is mounted on one side of the mounting pad and electrically connected to all leads 10. Nearly all the electronic component 20 and the leads 10 are sealed up with sealing material 30 from the side where the electronic component 20 is mounted. The holding part is removed by etching, and the leads 10 and the mounting pad 11 are electrically separated from each other. By this setup, a thin electronic component mounting device 100 is easily and surely manufactured. |
