| 摘要 |
<p>An exposure method, an exposure apparatus and a device manufacturing method are provided to reduce the alignment processing time by successively arranging a plurality of substrates using the mark formed on the substrate. A substrate is arranged using the mark formed on the top of the substrate(S101). The location of the first mark is detected by the first scope. The location of second mark is detected by the second scope having the magnification which is higher than the magnification of the first scope(S102). The first correction value is calculated based on detection results obtained in the first detection step and the second detection step(S104). The location of third mask is detected by the second scope. The second correction value is calculated based on detection results obtained in the second detection step and the third detection step(S111). After the substrate is arranged based on the second correction value, the substrate is exposed(S112).</p> |
