An apparatus and a method for bonding substrates are provided to obtain uniformity of absorption and absorption cancellation of substrates. The first substrate is absorbed to the first absorption plate with electrostatic force applied from the first electrostatic block(233) connected to the first absorption plate(232). The second substrate is absorbed to the second absorption plate by electrostatic force applied from the second electrostatic block(243) connected to the second absorption plate(242). The first electrostatic block is connected to a ground electrode. The first substrate is separated from the first absorption plate.
