| 摘要 |
A substrate processing apparatus and method for treating substrates substrate is provided to reduce the used amount of the organic solvent by performing a heating process using deionized water. The organic solvent or the mixed fluid including the organic solvent is sprayed to the upper side of the substrate(W) to dry the upper side of substrate. While the upper side of substrate is dried by the organic solvent or the mixed fluid, the cleaning solution is supplied to the bottom surface of substrate to wash the bottom surface of substrate. The cleaning solution is supplied to the bottom surface of substrate, of temperature higher than room temperature is heated. The apparatus for supporting the substrate comprises the spin head(310), the supporting substrate, the nozzle member(400), and the lower nozzle member(500) and the heater.
|
