发明名称 Semiconductor chip and method of manufacturing semiconductor chip
摘要 A semiconductor chip includes a semiconductor substrate having a first principal surface, and having a device layer on the first principal surface in which a semiconductor device is formed, an electrode pad disposed on the first principal surface of the semiconductor substrate and electrically connected to the semiconductor device, a through via formed in a through hole penetrating through the semiconductor substrate and the electrode pad, and an Au bump deposited on the electrode pad and the through via such as to electrically connect between the electrode pad and the through via.
申请公布号 US7576004(B2) 申请公布日期 2009.08.18
申请号 US20080028924 申请日期 2008.02.11
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 SUNOHARA MASAHIRO;HIGASHI MITSUTOSHI
分类号 H01L21/768 主分类号 H01L21/768
代理机构 代理人
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