发明名称 Method of applying a polymer thick-film resistive paste for making polymer thick-film resistor having improved tolerances
摘要 The present invention teaches formulations, apparatus and a method of applying high thixotropic index polymer thick-film resistive pastes for making polymer thick-film resistors with improved tolerances by providing a squeegee with a blade tilted at an angle of 10° to 85° to the surface of the printed circuit board thus causing a fluid rotational motion within the bead of the polymer thick-film resistive paste as the squeegee blade moves relative to the printed circuit board. This rotational motion increases the shear strain rate experienced by the paste within the bead and results in a more effective filling of the resistor-shaped cavity without including air bubbles, experiencing elastic recovery of the paste and, without surface fractures of the paste.
申请公布号 US7575778(B2) 申请公布日期 2009.08.18
申请号 US20040913869 申请日期 2004.08.07
申请人 EMBED TECHNOLOGY CO., LTD. 发明人 SU TE-YEU;WANG HSIN-HERNG;CHU YING-TI;CHU CHIN-MING;PING LI-CHUNG
分类号 B05D5/12;B05D3/12;H01C7/00;H01C17/065;H05K1/09;H05K1/16;H05K3/12 主分类号 B05D5/12
代理机构 代理人
主权项
地址