发明名称 |
MULTILAYER PRINTED WIRING BOARD AND MOUNTING BODY USING THE SAME |
摘要 |
A multilayer printed wiring board (11) is composed of a plurality of printed wiring boards (21a, 21b) having wiring formed on the front layer, and a relaxing connecting layer (15), which connects the printed wiring boards (21a, 21b) to each other and has a inorganic filler, a thermosetting resin and a relaxing material for relaxing internal stress. The multilayer printed wiring board has a small warping quantity by eliminating internal stress generated by heating and cooling due to solder reflow and the like, by means of the relaxing connecting layer (15) arranged on the inner layer. |
申请公布号 |
WO2009090878(A1) |
申请公布日期 |
2009.07.23 |
申请号 |
WO2009JP00137 |
申请日期 |
2009.01.16 |
申请人 |
PANASONIC CORPORATION;NAKAMURA, TADASHI;ECHIGO, FUMIO;KATSUMATA, MASAAKI |
发明人 |
NAKAMURA, TADASHI;ECHIGO, FUMIO;KATSUMATA, MASAAKI |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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