发明名称 |
IMPROVED SOLUTION DEPOSITION ASSEMBLY |
摘要 |
Methods and devices are provided for improved sputtering systems. In one embodiment of the present invention, a deposition system for use with a substrate, the system comprising a solution deposition apparatus; at heating chamber; and at least assembly for holding solution over the substrate to allow for a depth of at least about 0.5 microns to 10 mm. |
申请公布号 |
WO2009029954(A3) |
申请公布日期 |
2009.07.23 |
申请号 |
WO2008US75063 |
申请日期 |
2008.09.02 |
申请人 |
ROUSSILLON, YANN;UTTACHOO, PIYAPHANT |
发明人 |
ROUSSILLON, YANN;UTTACHOO, PIYAPHANT |
分类号 |
H01L21/208;H01L31/042 |
主分类号 |
H01L21/208 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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