| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminated printed wiring board for reducing electromagnetic, capacitive and inductive cross coupling and crosstalk in electrical circuits, electronic modules, and systems. <P>SOLUTION: The printed wiring board exists between analog, digital, radio frequency (RF) layers, or an assembly of mixed circuit printed wiring constructions for generally controlling the reduction utilizing dissipative carbon layers 76. Connection between layers can be made by the use of insulated vias 70 when connection to the carbon layer is not desired. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
