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发明名称
METHODS AND APPARATUS FOR BONDING DEFORMABLE MATERIALS HAVING LOW DEFORMATION TEMPERATURES
摘要
申请公布号
KR20010031796(A)
申请公布日期
2001.04.16
申请号
KR1020007004863
申请日期
2000.05.04
申请人
发明人
分类号
C09J5/06
主分类号
C09J5/06
代理机构
代理人
主权项
地址
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