HEATING ELEMENT MOUNTABLE COMPONENT, METAL BODY, AND ATTACHING STRUCTURE OF HEATING ELEMENT MOUNTABLE COMPONENT

摘要

PROBLEM TO BE SOLVED: To achieve highly efficient thermal control, and also to achieve highly efficient electrical conduction as well as convenient and easy manufacture. SOLUTION: A plurality of deformable protrusions 16 are provided on the back side of a base plate 10 with a semiconductor device 12 mounted thereon and the protrusions 16 are connected onto a heat sink 18 by pressure bonding to attach the heat sink 18 through thermal connection. COPYRIGHT: (C)2009,JPO&INPIT