发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device in which an ohmic electrode of low contact resistance over a long period of time to an n-type nitride semiconductor layer, and to provide a manufacturing method therefor. SOLUTION: The semiconductor device is provided with an n-type semiconductor layer 10, a first metal layer 20 formed on the n-type semiconductor layer 10, a second metal layer 30 formed on the first metal layer 20, and SiN<SB>y</SB>40 formed so as to cover the surface of the n-type semiconductor layer 10, the side faces of the first and the second metal layers 20 and 30, and the surface which excludes a prescribed region on the second metal layer 30. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009164526(A) 申请公布日期 2009.07.23
申请号 JP20080003139 申请日期 2008.01.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUKITA MUNEYOSHI;NANJO TAKUMA;OISHI TOSHIYUKI;ABE YUJI;TOKUDA YASUKI
分类号 H01L21/28;H01L21/338;H01L29/778;H01L29/812 主分类号 H01L21/28
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