发明名称 |
Wiring Boards and Processes for Manufacturing the Same |
摘要 |
A wiring board includes an insulating substrate and a wiring pattern. The wiring pattern includes a main body and an upper end portion and is embedded in the insulating substrate while exposing at least the upper end portion on a surface of the insulating substrate. The upper end portion has a cross-sectional width smaller than that of a lower end portion of the wiring pattern embedded in the insulating substrate. The upper end portion is formed of a metal that is more noble than a metal of the main body of the wiring pattern. The wiring board having this structure achieves very high adhesion of the wiring pattern to the insulating layer.
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申请公布号 |
US2009183901(A1) |
申请公布日期 |
2009.07.23 |
申请号 |
US20070836522 |
申请日期 |
2007.08.09 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
KATAOKA TATSUO;KAWAMURA HIROKAZU |
分类号 |
H05K1/02;G03F7/20 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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