发明名称 |
METHOD OF FORMING POLYCRYSTALLINE SEMICONDUCTOR FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a polycrystalline semiconductor film that forms a polycrystalline semiconductor film having a larger crystal grain size, with a manufacturing yield much higher than that of the conventional method. SOLUTION: An amorphous silicon film is formed on a substrate 10 formed of a glass plate or the like, and this amorphous silicon film is patterned to form main patterns P1 resembling islands or belts having a protruded end and a sub-pattern P2 for filling the gaps between the main patterns P1. While the substrate 10 is irradiated with the continuous wave laser beam, a polycrystalline semiconductor film is formed by scanning the laser irradiating region toward the rear end from the front end of the main patterns. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009164652(A) |
申请公布日期 |
2009.07.23 |
申请号 |
JP20090106137 |
申请日期 |
2009.04.24 |
申请人 |
SHARP CORP |
发明人 |
TAKEI MICHIKO;SENDA MITSURU;TAKEUCHI FUMIYO;HARA AKITO |
分类号 |
H01L21/20;H01L21/268;H01L21/336;H01L29/786 |
主分类号 |
H01L21/20 |
代理机构 |
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地址 |
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