| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device allowing a filler to be filled in a space between a semiconductor element and a substrate in a short time while avoiding a filling failure of the filler. SOLUTION: In this semiconductor device 1, a semiconductor chip 10 is jointed to a substrate 20 through solder balls 11 arranged between the semiconductor chip 10 and the substrate 20, and the joint between the semiconductor chip 10 and the substrate 20 is reinforced by filling an underfill agent 31 in a space formed between the semiconductor chip 10 and the substrate 20 jointed through the solder balls 11. In the semiconductor chip 10, a surface (undersurface) facing the substrate 20 is formed as a surface inclined to set a space on the side opposite to the filling side of the underfill agent 31 larger than a space on the filling side, the cross-sectional areas of the solder balls 11 are set in accordance with a distance from a filling opening 22 side of the semiconductor chip 10, and the solder balls 11 are radially arranged centering the filling opening 22. COPYRIGHT: (C)2009,JPO&INPIT
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