| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus in which humidity of external air does not advance into the solid-state imaging apparatus even if external stresses, such as heat by soldering, is added, and to provide a method of manufacturing the same. SOLUTION: In a solid-state imaging apparatus, an image sensor chip 12 is mounted and fixed to a concave part 11a provided in a ceramic package 11. A cover glass 16 is mounted on the ceramic package 11, and adhered by an ultraviolet hardening adhesive agent 17 to seal the concave part 11a of the ceramic package 11. The ceramic package 11 is mounted on a mounted board 20, and an external terminal 21 provided in the ceramic package 11 is soldered to a solder land provided on the mounted board 20. A sealing agent 25a is applied to a range from a periphery 16a of the cover glass 16 to the mounted board 20 except a transparent region 26 of received light of the image sensor chip 12. The sealing agent 25a is hardened to form a moisture prevention sealing member 25, and an outer edge 17a of the adhesive agent 17 is sealed. COPYRIGHT: (C)2009,JPO&INPIT
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