发明名称 SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To appropriately control the temperature of a soldering part. SOLUTION: The soldering device 100 includes a laser component 101, optical systems 102, 103, 104, 105, 106, 107, a temperature detector 108, and laser beam control parts 109, 110, 111, 112. The laser component 101 outputs laser beam, and the optical systems 102, 103, 104, 105, 106, 107 converge laser beam and irradiate a soldering part 12 with it. The temperature detector 108 detects the temperature of the soldering part 12. The laser beam control parts 109, 110, 111, 112 control the laser beam outputted from the laser component 101 so that the temperature detected by the temperature detector 108 becomes a predetermined temperature which melts the solder 10 applied to the soldering part 12. By this configuration, the temperature of the soldering part 12 can be appropriately controlled. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009160603(A) 申请公布日期 2009.07.23
申请号 JP20070340906 申请日期 2007.12.28
申请人 SANYO ELECTRIC CO LTD;SANYO MEDIATEC CO LTD 发明人 KOGURE KAZUYA;MIYOSHI OSAMU;AOKI TAKESHI
分类号 B23K1/005;B23K1/00;B23K101/36;H05K3/34 主分类号 B23K1/005
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