| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure for a semiconductor element that can avoid short circuit between a pad to be originally mounted with a projecting electrode of the semiconductor element, and wiring adjacent to the pad even when the projecting electrode of the semiconductor element is mounted on a substrate being shifted from the pad to be originally mounted with it. SOLUTION: The mounting structure for the semiconductor element includes the substrate 11; first wiring 101 formed on the substrate 11; second wiring 103 formed on the substrate 11 and arranged adjoining the first wiring 101 within a display area; first pads 111-1, 111-2 formed on the first wiring 101 within an IC arranging area; second pads 112-1, 112-2 formed on the second wiring 103 adjacently to the first wiring 101 within the IC arranging area; and the semiconductor element having a plurality of projecting electrodes connected to the first and second pads 111-1, 111-2, 112-1, 112-2. The first wiring 101 is arranged directly under the second pads 112-1, 112-2 through an insulating layer within the IC arranging area. COPYRIGHT: (C)2009,JPO&INPIT
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