| 摘要 |
A method for laminating substrates may include disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate, disposing the first substrate, the pressure-sensitive adhesive layer, and the second substrate within a vacuum chamber, evacuating the vacuum chamber, and applying a pressure to at least one of the first substrate and the second substrate. |
| 申请人 |
ROCKWELL COLLINS, INC.;BARNIDGE, TRACY, J.;NEMETH, PAUL, R.;SAMPICA, JAMES, D.;MARZEN, VINCENT, P.;TCHON, JOSEPH, L. |
发明人 |
BARNIDGE, TRACY, J.;NEMETH, PAUL, R.;SAMPICA, JAMES, D.;MARZEN, VINCENT, P.;TCHON, JOSEPH, L. |
