| 摘要 |
<p>The process involves supplying a microstructure with a cavity (25) filled with a sacrificial material e.g. silicon dioxide, where the cavity is limited over a part of a surface of the cavity by an impermeable membrane (23) and is rendered permeable by an action of a chemical etchant. The microstructure is contacted with the chemical etchant to make the membrane permeable and degrade the sacrificial material. The chemical etchant is removed from the microstructure to obtain an air gap, where the chemical etchant is provided as a fluid containing hydrofluoric acid and/or ammonium fluoride. The sacrificial material is selected from combination of silicon, carbon, hydrogen and oxygen or combination of silicon, carbon, nitrogen, hydrogen and oxygen.</p> |
