COMPOSITION FOR FORMATION OF UPPER LAYER FILM, AND METHOD FOR FORMATION OF PHOTORESIST PATTERN

摘要

Disclosed is a composition for forming an upper layer film, which can form an upper layer film having a satisfactorily high receding contact angle and which can be used for forming an upper layer film on the surface of a photoresist film. The composition comprises a resin (A) which has a repeating unit represented by the general formula (1-1) and does not have any repeating unit represented by the general formula (1-2) and a resin (B) which has a repeating unit represented by the general formula (1-2) and does not have any repeating unit represented by the general formula (1-1). (1-1) (1-2) wherein R1 represents a hydrogen or the like; R2 represents a single bond or the like; and R3 represents a fluorine-substituted linear or branched alkyl group having 1 to 12 carbon atoms or the like.