| 摘要 |
A semiconductor device of the present invention has a base plate, a digital circuit section provided on a side of an upper surface of the base plate and having a plurality of external connection electrodes, an insulating layer provided on the base plate around the digital circuit section and on the digital circuit section, a plurality of upper conductive layers provided on the insulating layer and connected to the external connection electrodes of the digital circuit section, a plurality of lower conductive layers provided on a side of a lower surface of the base plate, an upper and lower conducting portion which penetrates the base plate and the insulating layer and connects at least one of the upper conductive layers with at least one of the lower conductive layers, an analog circuit section connected to at least one of the upper conductive layers and one of the lower conductive layers, and a shield cover covering the analog circuit section.
|
