发明名称 ELECTRONIC EQUIPMENT, COOLER, AND HEAT PIPE
摘要 <p><P>PROBLEM TO BE SOLVED: To suppress drying-out from being generated inside a heat pipe, in a cooler for cooling a plurality of heat generating elements. <P>SOLUTION: This electronic equipment 10 is provided with a substrate 20 including a first heat generating element 21 and a second heat generating element 22, and a cooler 30 for cooling respectively the first heat generating element 21 and the second heat generating element 22. The cooler 30 has one heat pipe 40 with coolant passages formed inside, and including a first cooling part 40A for cooling the first heat generating element, a second cooling part 40B for cooling the second heat generating element, and a blocking part 43d for blocking the connection between the coolant passages of the first cooling part 40A and the coolant passages of the second cooling part 40B. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009080567(A) 申请公布日期 2009.04.16
申请号 JP20070247836 申请日期 2007.09.25
申请人 TOSHIBA CORP 发明人 OKUTSU ISAO
分类号 G06F1/20;F28D15/02;H01L23/427;H05K7/20 主分类号 G06F1/20
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