| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, and an inspection method of the semiconductor device, in which an internal circuit connected to signal terminals having wiring formed between chips is inspected without increasing the number of terminals drawn-out to the outside of a package. SOLUTION: Each output from output buffers 36-38 is set into a blocked state by controlling analog switches 39-41, and a power supply terminal 11 is set into an inspection state connected to a signal terminal 13 by controlling analog switches 42-44. Thereafter, a control signal 34 is switched into a fluctuation suppression state by stopping supply of a clock signal CK to the control signal 34. Then, an inspection voltage (3V) is supplied to a semiconductor chip 3 through external terminals 6, 7. In this case, the potential of a power supply terminal 16 is set at 5V, and the potential of a ground terminal 17 is set at 2V. COPYRIGHT: (C)2009,JPO&INPIT
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