| 摘要 |
The invention concerns an element to be driven, a driving element designed to be urged into engagement with the element to be driven and an actuating element adapted to move the driving element so that it drives the element to be driven in step-by-step displacement, the driving element and the actuating element being formed by etching in a semiconductor material wafer. The invention is characterized in that it comprises elastic prestressing means for maintaining the driving element in contact with the element to be driven.
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