| 摘要 |
A cooling structure for an electric device includes a plurality of cooling medium paths (724) through which a cooling medium for an inverter flows, an inlet (722) into which the cooling medium to be supplied to the plurality of cooling medium paths (724) flows, and a wall (726) provided between the inlet (722) and the plurality of cooling medium paths (724) to promote distribution of the cooling medium to each of the cooling medium paths (724).
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